统一一下灯珠的翻译口径 贴片灯珠SMD chip 可用LED chip代指

ledpan

Q:统一一下灯珠的翻译口径
( x0 A5 V3 Q* O贴片灯珠：SMD chip，可用LED chip代指，当然LED chip可以泛指所有的LED灯珠，别用LED bead，很土。除了COB以外的大功率集成芯片，用LED array更合适点，当然也可以说integrated array。光源、散热、驱动、光学部件一体的叫LED light engine，CREE网站上也叫LED module。如果你怕误译，就直接LED，比如RGB灯珠，一般翻译成RGB LEDs
A:chip是芯片，一般说成是晶元，我不认为这种翻译正确，osram chips。
# F- |; D$ @" e8 }Q:裸片叫LED die
) {- ~$ Y- D6 b7 ]  VA:裸片叫wafer
Q:封装好的叫LED package，但一般都说成LED chip
LED die  - A small, block of light-emitting semi-conducting material on which a functional LED circuit is fabricated.
) O4 _: C1 Y, U6 d2 J0 I1 S  l
LED package -An assembly of one or more LED dies that includes wire bond or other type of electricai connections, possibly with an optical element and thermal, mechanical, and electrical interfaces.
/ |) o4 p1 E4 J6 ~A: die是晶元，wafer晶片，老外不怎么说led package。
+ p9 H8 L  p! wQ:我说的裸片是没有封装过的，led package是IES的标准解释。

DragonGuy

瓜娃子，已经有一贴了
https://www.ledpan.com/forum.php?mod=viewthread&tid=19504

ledpan

DragonGuy 发表于 2016-9-19 15:34
瓜娃子，已经有一贴了
https://www.ledpan.com/forum.php?mod=viewthread&tid=19504

嘎嘎，还是熊爸厉害哇，JOY也很棒！