6 layer CSP mounted via in pad PCB

ledpan

6 layer CSP mounted via in pad PCB

	PCB dimension:	93.25 x 104.12mm=1PCS
	Basic stack up:	6 Layer PCB
		copper ------- 18um(0.5oz)+plate TOP layer
		Prepreg 7628 0.195mm
		copper ------- 18um(0.5oz) MidLayer 1
		FR-4 0.1mm
		copper ------- 18um(0.5oz) MidLayer 2
		Prepreg 7628 0.195mm
		copper ------- 18um(0.5oz) MidLayer 3
		FR-4 0.1mm
		copper ------- 18um(0.5oz) MidLayer 4
		Prepreg 7628 0.195mm
		copper ------- 18um(0.5oz)+plate BOT Layer
	Minimum trace and space	4mil/4mil
	Minimum / maximum holes	0.2/1.3mm
	Number of different holes	11
	Number of drill holes	9840
	Number of milled slots	0
	Material:	SHENGYI FR-4
	Surface finish:	Immersion gold (19.1% area)
	Solder mask:	Gloss green
	Contour:	rout (mill)
	Via:	plated through hole(PTH), min. size 0.2mm, via in pad technique, blind via from TOP to midLayer 1
	Final height of PCB	1.1mm ±0.1
	function:	CSP mounted PCB

If you have requirement on PCB prototypes, please reply back to this email or following contact by your gerber files and we will get back to you ASAP.

Christina Lau | Business development


Bicheng PCB |(86-755-21949341 | www.bicheng-pcb.com | sales10@bicheng-pcb.com


If you do not want to receive emails from Bicheng about marketing communications, reply as “remove” in the subject line.


Bicheng is located at Baoan, Shenzhen, China 51803.