6 layer CSP mounted via in pad PCB
6 layer CSP mounted via in pad PCBPCB dimension:93.25 x 104.12mm=1PCS
Basic stack up:6 Layer PCB
copper ------- 18um(0.5oz)+plate TOP layer
Prepreg 7628 0.195mm
copper ------- 18um(0.5oz) MidLayer 1
FR-4 0.1mm
copper ------- 18um(0.5oz) MidLayer 2
Prepreg 7628 0.195mm
copper ------- 18um(0.5oz) MidLayer 3
FR-4 0.1mm
copper ------- 18um(0.5oz) MidLayer 4
Prepreg 7628 0.195mm
copper ------- 18um(0.5oz)+plate BOT Layer
Minimum trace and space4mil/4mil
Minimum / maximum holes0.2/1.3mm
Number of different holes11
Number of drill holes9840
Number of milled slots0
Material:SHENGYI FR-4
Surface finish:Immersion gold (19.1% area)
Solder mask:Gloss green
Contour:rout (mill)
Via:plated through hole(PTH), min. size 0.2mm, via in pad technique, blind via from TOP to midLayer 1
Final height of PCB1.1mm ±0.1
function:CSP mounted PCB
If you have requirement on PCB prototypes, please reply back to this email or following contact by your gerber files and we will get back to you ASAP.
Christina Lau | Business development
Bicheng PCB |(86-755-21949341 | www.bicheng-pcb.com | sales10@bicheng-pcb.com
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Bicheng is located at Baoan, Shenzhen, China 51803.
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